Technical Support, Research and Development

We have constantly active research and development together with our wide range partner network. We use our state-of-the-art laboratory equipment together with our customers’ needs to improve and develop our products. Our metallurgical and application know-how enable us to offer unique services for our partners.

We provide all the relevant metallurgical and destructive and non-destructive tests; mechanical properties (tensile/yield strength, hardness, stress-strain curves), electrical conductivity, coating thickness, element analysis, and grain size determination. The list goes on. Contact us to discuss more.

Technical support with newest high-technology machinery

Complementary high-tech equipment such as the nanoindenter, 3D surface profilers (laser confocal scanning & white light interferometry) and high-quality confidential equipment ensure a unique depth of analysis.

Our services include (but are not limited to) support in following highly sophisticated topics:

• Material recommendation for existing and new technologies (including IMS, Thermal Diffusion Bonding, and so on)
• High temperature brazing and bonding simulations for AMB and DCB
• Alloy optimization for different applications
• Flat and pin fin base plate optimization
• Alternative solutions to avoid soldering cracks due to temperature changes
• Alternative solutions to Al wire bonding
• Elastic modulus (Youngs modulus) and Fracture Toughness
• Measuring of copper characterizations from bonded/brazed copper-ceramic substrates
• Berkovich tip
• X-ray fluorescence spectroscopy (XRF)
• Energy dispersive X-ray spectroscopy (EDX)